Back Filling Compound

Products Description

Back Filling Compound is chemically inert, non-corrosive, and suitable for all types of earthing electrodes including GI earthing electrode, copper bonded earthing electrode, and pure copper earthing electrode. The compound retains moisture, preventing the earthing system from drying out, and helps maintain consistent low resistance throughout the year—especially in dry and rocky soil conditions.

Ideal for use in residential, commercial, and industrial installations, ADAS Earthlink’s Back Filling Compound complies with national and international safety standards for grounding systems.

Composition:

• Bentonite clay (for moisture retention)
• Graphite powder (for high conductivity)
• Carbon-based conductive materials
• Salt-based minerals (in some types)
• Sometimes, cementitious binders or swelling agents (for long-term soil bonding)

Key Features:

• Lower Earthing Resistance Enhanced Moisture Retention
• Enhancing Earthing Performance Increased Stability and Longevity
• Corrosion Protection Compliance

How Backfilling Compound is Used:

• Prepare the Earthing Pit: Create a suitable-sized pit or trench for the earthing electrode.
• Place the electrode: Place the earthing electrode (rod, plate, or strip) in the prepared pit and connect it to the electrical system.
• Mix the Compound (if necessary): Some compounds come in powder form and must be combined with water to generate a slurry or paste. Others can be used in their dried condition. Always follow the manufacturer’s mixing ratios.
• Fill the Pit: Carefully pour or place the backfilling compound around the electrode, making sure it is completely surrounded.
• Compact the Compound: If necessary, compact the compound to ensure proper contact and eliminate air spaces. Watering the soil after filling might also help to reduce compaction.