Back Filling Compound
Back Filling Compound, also known as earthing compound or earth resistivity booster, is a material used in the construction of earthing systems to enhance the conductivity and longevity of the grounding electrodes. It is typically used to fill the space around buried grounding electrodes, such as ground rods or plates, to provide a low-resistance connection to the surrounding soil.
Product Description
Back Filling Compound is chemically inert, non-corrosive, and suitable for all types of earthing electrodes including GI earthing electrode, copper bonded earthing electrode, and pure copper earthing electrode. The compound retains moisture, preventing the earthing system from drying out, and helps maintain consistent low resistance throughout the year—especially in dry and rocky soil conditions.
Ideal for use in residential, commercial, and industrial installations, ADAS Earthlink’s Back Filling Compound complies with national and international safety standards for grounding systems.
Key Features:
- Lower Earthing Resistance Enhanced Moisture Retention
- Enhancing Earthing Performance Increased Stability and Longevity
- Corrosion Protection Compliance
Review Back Filling Compound.